New Module Technology

The rapid commercialisation of TOPCon, heterojunction (HJT), perovskite, and tandem cell technologies is changing the field testing landscape in ways that existing IEC standards and conventional instruments are not fully equipped to address. Higher open-circuit voltages, different temperature coefficients, and unique degradation signatures all require updated measurement approaches. This section tracks the testing implications of emerging module technologies and provides practical guidance for technicians and engineers working with next-generation products.